Silicone Encapsulants and Pottings
Product description
DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy application cases. DOWSIL™ and SYLGARD™ Silicone encapsulants (or pottants) are protective materials used to completely embed electronic circuitry. Typically, they are used to protect circuits from harmful effects of moisture and other contaminants, provide electrical insulation for high voltages and also protect the circuit and interconnections from thermal and mechanical stress. Encapsulants are typically applied in thick layers – exceeding 125 mµ.
DOWSIL™ and SYLGARD™ encapsulants are supplied as solventless, two-component liquid component kits. Many are designed for a 1:1 mixing ratio (parts A and B). When the two liquid components are thoroughly mixed, the mixture cures to a flexible elastomer. Some products will cure at room temperature while others are designed to be cured by heat.
| Product | Viscosity [mPas] | Mixing ratio | Cure time (Pot Life) |
|---|---|---|---|
| DOWSIL™ 3-6121 Low Temperature Elastomer | 19,000 | 10:1 | 20 min @100 °C, 10 min @150 °C (2h) |
| DOWSIL™ 3-6512 Elastomer | 900 | 1:1 | 2 h @70 °C (24 h) |
| DOWSIL™ 3-8264 Encapsulant | 2,650 | 1:1 | 2.5 h @70 °C, 30 min @100 °C |
| DOWSIL™ 93-500 Space Grade | 8100 | 10:1 | 10 min @100 °C, 4 min @150 °C (3h) |
| DOWSIL™ 93-500 Thixotropic Encapsulant | Non-flow | 10:1 | 15 min @100 °C, 10 min @125 °C, 5 min @150 °C (1h) |
| DOWSIL™ SE 1816 CV Encapsulant | 2,600 | 1:1 | 1 h @100 °C (24 h) |
| DOWSIL™ EE-1010 Low Viscosity Encapsulant | 850 | 1:1 | 24 h @RT, 3 min @100 °C, 2 min @150 °C, (50 min) |
| DOWSIL™ EE-1840 Encapsulant | 1,300 | 1:1 | 7 d @25 °C, Heat accelerable (12 min) |
| DOWSIL™ EE-3200 Low Stress Encapsulant | 1,700 | 1:1 | 20 min @50 °C (30 min) |
| SYLGARD™ 160 Silicone Elastomer | 4,500 | 1:1 | 24 h @25 °C, 4 min @100 °C, (20 min) |
| SYLAGRD™ 164 Silicone Elastomer | 9,100 | 1:1 | 35 min @25 °C (-) |
| SYLGARD™ 170 Silicone Elastomer | 2,100 | 1:1 | 24 h @25 °C , 45 min @50 °C , 25 min @70 °C , 15 min @80 °C , 10 min @100 °C (15 min) |
| SYLGARD™ 170 Fast Cure Silicone Elastomer | 2,300 | 1:1 | 10 min @25 °C (<5 min) |
| SYLGARD™ 182 Silicone Elastomer | 5,700 | 10:1 | 14 days @25 °C, 75 min @100 °C, 30 min @125 °C, 20 min @150 °C (8 h) |
| SYLGARD™ 184 Silicone Elastomer | 3,500 | 10:1 | 48 h @25 °C, 35 min @100 °C, 20 min @125 °C, 10 min @150 °C (90 min) |
| SYLGARD™ 186 Silicone Elastomer | 65,000 | 10:1 | 48 h @25 °C, 25 min @100 °C, 15 min @150 °C (100 min) |
| SYLGARD™ 567 Primerless Silicone Encapsulant | <1,500 | 1:1 | 180 min @70 °C 120 min @100 °C (3 days) |
Tradename(s)
DOWSIL™ SYLGARD™
Country availability
| Austria | Bosnia and Herzegovina |
| Bulgaria | Croatia |
| Czech Republic | Estonia |
| Germany | Hungary |
| Latvia | Lithuania |
| Macedonia | Montenegro |
| Norway | Poland |
| Romania | Serbia |
| Slovakia | Slovenia |
| Switzerland | Turkey |
| Ukraine |
Contact person
Eray Berberoğlu
Product Manager
Further information
Electronics Portfolio
pdf (3.2 MB)
Silicone Encapsulants and Gels
pdf (1.2 MB)