Silicone Thermally Conductive Compounds
DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.
We offer a wide variety of thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many devices configurations and perform well in accommodating high tolerances between surfaces.
As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.
DOWSIL™ thermally conductive compounds are used as filling between heat source and heat sink. A very thin bond line thickness is achievable, but materials nevertheless show common properties such as low thermal resistance and high thermal conductivity. These no-cure materials offer thermal conductivity of up to 4.3 W/mK.
|Product||Thermal Conductivity [W/mK]||Viscosity [mPas]|
|DOWSIL™ 340 Heat Sink Compound||0.67||542,000|
|DOWSIL™ SC 102 Compound||0.9||29,000|
|DOWSIL™ TC-5080 Thermal Grease||1||836,000|
|DOWSIL™ SE 4490 CV Thermally Conductive Compound||1.9||520,000|
|DOWSIL™ TC-5121 C Thermally Conductive Compound||2.8||79,000|
|DOWSIL™ TC-5351 Thermally Conductive Compound||3.3||300,000|
|DOWSIL™ TC-5622 Thermally Conductive Compound||4.3||95,000|
|DOWSIL™ TC-5625 Thermally Conductive Compound||2.5||102,125|
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