Silicone Two-part Room Temperature Condensation Cure Adhesive & Sealant

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. DOWSIL™ and SILASTIC™ silicone adhesives are used primarily to attach components, such as module lids and baseplates, within electronic modules or seal openings in the module to exclude dirt, water or other contaminants. A key benefit of silicone adhesives is their potential to significantly increase the reliability of an electronic module or component because of their stress-relieving properties. The adhesives in our portfolio have a “rubbery”, elastomeric nature and are not conventional, highly rigid adhesives. This low stress environment can reduce damage to module components and interconnections. They are also able to maintain their stress-relieving nature throughout exposure to extreme environmental conditions such as high temperature and humidity. DOWSIL™ and SILASTIC™ Silicone adhesives also offer versatile processing. Some are cured at room temperature, while others can be accelerated by heat. This can allow faster process times or the use of lower temperature capable materials, depending on the needs of your application and process. More recently developed products are resulting in even faster and lower temperature curing capability. The line of adhesives available is also offered in a range of flow properties to fill gaps and channels, or to remain in place as the application requires. 

A few of the condensation cure products are two-part formulations. These provide relatively fast room temperature cures and, because they contain their own source of moisture, can cure readily in more confined situations and in higher bond line thicknesses. Cure times range from about 30 minutes to 4 hours. The material will continue to cure and reach full properties within a period of 8 hours or up to a few days depending on the product being used. These cure times can be accelerated by up to 10 times with mild heating not exceeding 60 °C. Higher temperatures will not be of any benefit because severe bubbling in the material will result. Those products offer as well a fast in-depth cure, as no moisture is required compared to typical one component adhesives.

Product Hardness [ShA] Viscosity [mPas] Tensile Strength [MPa] Tack Free Time (Cure time) 
DOWSIL™ 93-076-2 RF Non-flowing 5.5 120 min (23 h @25 °C)
DOWSIL™ EA-2626 Adhesive 45 205,000 2.5 10 min (24 h @25 °C) 
DOWSIL™ EA-3838 Fast Adhesive 40 200,000 1.5 5 min (24 h @25 °C) 
DOWSIL™ EA 3500G Fast Cure Silicone Adhesive 55 119,000 1.5 5 min (3-7 days @25 °C) 
SILASTIC™ Q3-3636 adhesive 35 200,000 2 15 min (25 h @25 °C) 



Country availability

Austria Bosnia and Herzegovina
Bulgaria Croatia
Czech Republic Estonia
Germany Hungary
Latvia Lithuania
Macedonia Montenegro
Norway Poland
Romania Serbia
Slovakia Slovenia
Switzerland Turkey
Eray Berberoğlu

Contact person

Eray Berberoğlu

Product Manager

email   phone

Further information


Electronics Portfolio
pdf (3.2 MB)


Silicone Sealants Foams Industrial Assembly
pdf (374.8 KB)