Low-Temperature Silicone Gels
DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy application cases. DOWSIL™ and SYLGARD™ silicone gels are a special class of encapsulants that cure to an extremely soft material. Gels cure in place to form cushioning, self-healing, resilient materials. Cured silicone gels retain much of the stress relief and self-healing qualities of a liquid while providing the dimensional stability of an elastomer. Typically, gels are used to protect circuits from the harmful effects of moisture and other contaminants and provide electrical insulation for high voltages. Another key characteristic of most gels is a naturally tacky surface after cure. This natural adhesion allows gels to gain physical adhesion to most common surfaces without the need for primers. The tacky nature also results in the unique ability to re-heal if the cured gel has been torn or cut. The ability to re-heal permits the use of test probes directly through the gel for circuit testing.
DOWSIL™ and SYLGARD™ low-temperature silicone gels are used for sealing and protecting (by coating, encapsulating or potting) various electronic devices from thermal and/or mechanical shock and providing vibration dampening, especially those with delicate components and exposure to low temperatures.
|Product||Viscosity [mPas]||Penetration [1/10 mm]||Cure Time (Pot Life) |
|DOWSIL™ 3-4155 HV Dielectric Gel||1,850||90||60 min @RT (8 min)|
|DOWSIL™ 3-6635 Dielectric Gel||650||85||2 h @100 °C (11 min)|
|DOWSIL™ EG-3810 Gel||690||80||15 min @125 °C, 10 min @150 °C|
|DOWSIL™ Q3-6575 Dielectric Gel||670||80||20 min @100 °C, 40 min @70 °C (6 min)|
|Vatican City|| |
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