Silicone Two-part Heat Cure Adhesive & Sealant

DOWSIL™ SYLGARD™

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. DOWSIL™ and SYLGARD™ silicone adhesives are used primarily to attach components, such as module lids and baseplates, within electronic modules or seal openings in the module to exclude dirt, water or other contaminants. A key benefit of silicone adhesives is their potential to significantly increase the reliability of an electronic module or component because of their stress-relieving properties. The adhesives in our portfolio have a “rubbery”, elastomeric nature and are not conventional, highly rigid adhesives. This low stress environment can reduce damage to module components and interconnections. They are also able to maintain their stress-relieving nature throughout exposure to extreme environmental conditions such as high temperature and humidity. DOWSIL™ and SYLGARD™ silicone adhesives also offer versatile processing. Some are cured at room temperature, while others can be accelerated by heat. This can allow faster process times or the use of lower temperature capable materials, depending on the needs of your application and process. More recently developed products are resulting in even faster and lower temperature curing capability. The line of adhesives available is also offered in a range of flow properties to fill gaps and channels, or to remain in place as the application requires. Many of the flowable products will self-level to fill channels and cavities.

DOWSIL™ and SYLGARD™ two-part heat cure adhesives deliver greater control and flexibility in processing. Curing in a few minutes at temperatures of 150 °C or more energy-efficiently at lower temperatures. Material will be delivered as two-component material in mixing ratios of 1:1 and 10:1. This class of products cure in an additional reaction without any by-products.

ProductHardness [ShA]Viscosity [mPas]Tensile Strength [MPa]Cure time (Pot Life) 
DOWSIL™ 96-083 Silicone Adhesive5511,000630 min @150 °C (-)
DOWSIL™ EA-6052 Fast Low-Temp Cure Adhesive5011,0003.060 min @60 °C, 30 min @125 °C, 10 min @150 °C (6 h) 
DOWSIL™ EA-6060 Adhesive40115,0003.030 min @80 °C, 15 min @90 °C, 10 min @100 °C (1 h) 
DOWSIL™ SE 1700 Adhesive45650,0007.530 min @150 °C (8 h) 
DOWSIL™ SE 1720 CV Adhesive30100,0003.050 min @70 °C, 30 min @80 °C, 10 min @100 °C (6 h) 
DOWSIL™ Q5-8401 Adhesive6070,0006.090 min @120 °C (24 h) 
SYLGARD™ 577 Primerless Silicone Adhesive60110,0006.560 min @125 °C (22 h) 

Supplier

DOW™

Tradename(s)

DOWSIL™ SYLGARD™

Country availability

AustriaBosnia and Herzegovina
BulgariaCroatia
Czech RepublicEstonia
GermanyHungary
LatviaLithuania
MacedoniaMontenegro
NorwayPoland
SerbiaSlovakia
SloveniaSwitzerland
TurkeyUkraine

Other products from DOW™ portfolio

Eray Berberoğlu

Contact person

Eray Berberoğlu

Product Manager


email   phone

Further information