Silicone Thermally Conductive Dispensable Thermal Pads / Gap Filler
DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.
We offer a wide variety of thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.
As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.
DOWSIL™ thermally conductive dispensable pads are used as filling between heat source and heat sink. Materials are developed for precise printing of silicone pads, which are needed in complex shapes. DOWSIL™ dispensable pads are delivered as two-component materials with a mixing ratio of 1:1. Curing reaction allows to accelerate with moderate heat of between 75 °C and 120 °C. Thermal pads offer thermal conductivity of up to 2.5 W/mK
|Product||Thermal Conductivity [W/mK]||Viscosity [mPas]||Cure time |
|DOWSIL™ TC-4015 Dispensable Thermal Pad||1.71||103,000||48 min@75 °C, 16 min @100 °, 10 min @120 °C |
|DOWSIL™ TC-4016 Dispensable Thermal Pad||1.71||103,000||48 min@75 °C, 16 min @100 °C, 10 min @120 °C |
|DOWSIL™ TC-4025 Dispensable Thermal Pad||2.5||70,000||40 min@75 °C, 15 min @100 °C, 10 min @120 °C |
|DOWSIL™ TC-4026 Dispensable Thermal Pad||2.5||70,000||40 min@75 °C, 15 min @100 °C, 10 min @120 °C |
|DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler||3.4||205,000||120 min @25 °C, 10 min @80 °C |
|DOWSIL™ TC-4525 Thermally Conductive Gap Filler||2.6||217,000||120 min @25 °C, 10 min @80 °C |
|DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler||2.6||217,000||120 min @25 °C, 10 min @80 °C |
|DOWSIL™ SE 4448 CV Thermally Conductive Gap Filler||2.2||51,500||300 min@25 °C, 30 min @120 °C|
|DOWSIL™ TC-4515 Thermally Conductive Gap Filler||1.8||240,000||150 min@25 °C, 30 min @80 °C|
|DOWSIL™ TC-4515 CV Thermally Conductive Gap Filler||1.8||151,000||120 min@25 °C, 10 min @80 °C |
|DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler||2.0||140,000||360min@25 °C, 30 min @80 °C |
|Austria||Bosnia and Herzegovina|
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