Silicone Thermally Conductive Encapsulants
DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.
We are offering a wide variety of DOWSIL™ and SYLGARD™ thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.
As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.
DOWSIL™ and SYLGARD™ thermally conductive encapsulants are used as potting materials for high voltage transformers and sensors, assembly of heat sinks and fillers between heat sources.
|Product||Thermal Conductivity [W/mK]||Hardness [ShA]||Cure time (Pot Life) |
|SYLGARD™ 160 Silicone Elastomer||0.62||56 ||24 h @RT, 4 min @100 °C (20 min) |
|SYLGARD™ 164 Silicone Elastomer||0.64||61 ||36 min @RT (< 5 min) |
|SYLGARD™ 170 Silicone Elastomer||0.48||50 ||24 h @RT, 45 min @50 °C, 10 min @100 °C (15 min) |
|SYLGARD™ 170 Fast Cure Silicone Elastomer||0.4||45 ||10 min @ RT (< 5 min) |
|SYLGARD™ Q3-3600 Thermally Conductive Encapsulant||0.8||89 ||60 min@150 °C |
|SYLGARD™ 3-6605 Thermally Conductive Elastomer||0.85||79 ||90 min @100 °C,45 min @125 °C, 15 min @150 °C (>24 h) |
|DOWSIL™ CN-8760||0.65||49||45 min @50 °C (100 min) |
|DOWSIL™ CN-8760G ||0.67||45||24 h @RT, 30 min @60 °C (100 min) |
|DOWSIL™ TC-6020 Thermally Conductive Encapsulant||2.7||63 ||23 min @60 °C,13 min @80 °C, 5 min @100 °C |
|DOWSIL™ 3-6651 Thermally Conductive Elastomer||1.1||55 Sh00||60 min @120 °C |
|DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant||1.0||60||60 min @120 °C |
|DOWSIL™ TC-6011 Thermally Conductive Encapsulant||1.0||28||60 min @120 °C |
|Austria||Bosnia and Herzegovina|
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