Toughened Silicone Gels

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy application cases. DOWSIL™ Silicone gels are a special class of encapsulants that cure to an extremely soft material. Gels cure in place to form cushioning, self-healing, resilient materials. Cured silicone gels retain much of the stress relief and self-healing qualities of a liquid while providing the dimensional stability of an elastomer. Typically, gels are used to protect circuits from the harmful effects of moisture and other contaminants and provide electrical insulation for high voltages. Another key characteristic of most gels is a naturally tacky surface after cure. This natural adhesion allows gels to gain physical adhesion to most common surfaces without the need for primers. The tacky nature also results in the unique ability to re-heal if the cured gel has been torn or cut. The ability to re-heal permits the use of test probes directly through the gel for circuit testing.

DOWSIL™ toughened silicone gels are used for sealing and protecting (by coating, encapsulating or potting) various electronic devices, especially those requiring stronger adhesion or improved dimensional stability.

Product Viscosity [mPas] Hardness [Sh00] Cure time (Gel time)  
DOWSIL™ 3-4207 Dielectric Tough Gel 410 60 10 min @50 °C, 3 min @100 °C (7 min) 
DOWSIL™ 3-4222 Dielectric Firm Gel 340 35 2 min @100 °C, 1 min @125 °C (13 min) 
DOWSIL™ 3-4241 Dielectric Tough Gel 410 60 2 min @125 °C (> 1 h Pot Life) 
DOWSIL™ EG-3896 Gel 520 220g 30 min @70 °C, 5 min @150 °C (> 4 h Pot Life) 



Country availability

Austria Bosnia and Herzegovina
Bulgaria Croatia
Czech Republic Estonia
Germany Hungary
Latvia Lithuania
Macedonia Montenegro
Norway Poland
Romania Serbia
Slovakia Slovenia
Switzerland Turkey
Roberto Calvi

Contact person

Roberto Calvi

email   phone

Further information


Electronics Portfolio
pdf (3.2 MB)


Silicone Encapsulants and Gels
pdf (1.2 MB)