Silicone Thermally Conductive Encapsulants

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems. 

We are offering a wide variety of DOWSIL™  and SYLGARD™  thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.  

As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes. 

DOWSIL™ and SYLGARD™ thermally conductive encapsulants are used as potting materials for high voltage transformers and sensors, assembly of heat sinks and fillers between heat sources. 

Product Thermal Conductivity [W/mK] Hardness [ShA] Cure time (Pot Life) 
SYLGARD™ 160 Silicone Elastomer 0.62 56  24 h @RT, 4 min @100 °C (20 min) 
SYLGARD™ 164 Silicone Elastomer 0.64 61  36 min @RT (< 5 min) 
SYLGARD™ 170 Silicone Elastomer 0.48 50  24 h @RT, 45 min @50 °C, 10 min @100 °C (15 min) 
SYLGARD™ 170 Fast Cure Silicone Elastomer 0.4 45  10 min @ RT (< 5 min) 
SYLGARD™ Q3-3600 Thermally Conductive Encapsulant 0.8 89  60 min@150 °C 
SYLGARD™ 3-6605 Thermally Conductive Elastomer 0.85 79  90 min @100 °C,45 min @125 °C, 15 min @150 °C (>24 h) 
DOWSIL™ CN-8760 0.65 49 45 min @50 °C (100 min) 
DOWSIL™ CN-8760G  0.67 45 24 h @RT, 30 min @60 °C (100 min) 
DOWSIL™ TC-6020 Thermally Conductive Encapsulant 2.7 63  23 min @60 °C,13 min @80 °C, 5 min @100 °C 
DOWSIL™ 3-6651 Thermally Conductive Elastomer 1.1 55 Sh00 60 min @120 °C 
DOWSIL™ TC-4025 1.0 60 60 min @120 °C 
DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant 1.0 60 60 min @120 °C 
DOWSIL™ TC-6011 Thermally Conductive Encapsulant 1.0 28 60 min @120 °C 



Country availability

Austria Bosnia and Herzegovina
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Roberto Calvi

Contact person

Roberto Calvi

email   phone

Further information


Electronics Portfolio
pdf (3.2 MB)


Silicone Encapsulants and Gels
pdf (1.2 MB)


Thermally Conductive Materials Selection Guide
pdf (1.5 MB)