Speciality Silicone Gels

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. DOWSIL™ and FLUOROGEL™ silicone gels are a special class of encapsulants that cure to an extremely soft material. Gels cure in place to form cushioning, self-healing, resilient materials. Cured silicone gels retain much of the stress relief and self-healing qualities of a liquid while providing the dimensional stability of an elastomer. Typically, gels are used to protect circuits from the harmful effects of moisture and other contaminants and provide electrical insulation for high voltages. Another key characteristic of most gels is a naturally tacky surface after cure. This natural adhesion allows gels to gain physical adhesion to most common surfaces without the need for primers. The tacky nature also results in the unique ability to re-heal if the cured gel has been torn or cut. The ability to re-heal permits the use of test probes directly through the gel for circuit testing.

DOWSIL™ and FLUOROGEL™ speciality silicone gels are used for sealing and protecting (by coating, encapsulating or potting) various electronic devices from thermal and/or mechanical shock and providing vibration dampening. They are especially adapted for special requirements such as delicate components, low extractables, UV cure or resistance to solvents and fuels.

Product Viscosity [mPas] Penetration [1/10 mm] Cure time
DOWSIL™ 3-6371 UV Gel 820 140 7 days (UV + moisture) 
DOWSIL™ X3-6211 Encapsulant 850 50 UV Cure 
FLUOROGEL™ 4-8022 Gel 600 105 60 min @125 °C, 30 min @150 °C 
FLUOROGEL™ Q3-6679 Dielectric Gel 1,100 30 120 min @100 °C 



Country availability

Austria Bosnia and Herzegovina
Bulgaria Croatia
Czech Republic Estonia
Germany Hungary
Latvia Lithuania
Macedonia Montenegro
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Roberto Calvi

Contact person

Roberto Calvi

email   phone

Further information


Electronics Portfolio
pdf (3.2 MB)


Silicone Encapsulants and Gels
pdf (1.2 MB)