Silicone Thermally Conductive Encapsulants


Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems. 

We are offering a wide variety of DOWSIL™  and SYLGARD™  thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.  

As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes. 

DOWSIL™ and SYLGARD™ thermally conductive encapsulants are used as potting materials for high voltage transformers and sensors, assembly of heat sinks and fillers between heat sources. 

ProductThermal Conductivity [W/mK]Hardness [ShA]Cure time (Pot Life) 
SYLGARD™ 160 Silicone Elastomer0.6256 24 h @RT, 4 min @100 °C (20 min) 
SYLGARD™ 164 Silicone Elastomer0.6461 36 min @RT (< 5 min) 
SYLGARD™ 170 Silicone Elastomer0.4850 24 h @RT, 45 min @50 °C, 10 min @100 °C (15 min) 
SYLGARD™ 170 Fast Cure Silicone Elastomer0.445 10 min @ RT (< 5 min) 
SYLGARD™ Q3-3600 Thermally Conductive Encapsulant0.889 60 min@150 °C 
SYLGARD™ 3-6605 Thermally Conductive Elastomer0.8579 90 min @100 °C,45 min @125 °C, 15 min @150 °C (>24 h) 
DOWSIL™ CN-87600.654945 min @50 °C (100 min) 
DOWSIL™ CN-8760G 0.674524 h @RT, 30 min @60 °C (100 min) 
DOWSIL™ TC-6020 Thermally Conductive Encapsulant2.763 23 min @60 °C,13 min @80 °C, 5 min @100 °C 
DOWSIL™ 3-6651 Thermally Conductive Elastomer1.155 Sh0060 min @120 °C 
DOWSIL™ TC-4025 1.06060 min @120 °C 
DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant1.06060 min @120 °C 
DOWSIL™ TC-6011 Thermally Conductive Encapsulant1.02860 min @120 °C 





Country availability

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Czech RepublicEstonia

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Marica Djonovic

Contact person

Marica Djonovic

Supply Chain Specialist

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