Silicone Encapsulants and Pottings

DOWSIL™ SYLGARD™

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy application cases. DOWSIL™ and SYLGARD™ Silicone encapsulants (or pottants) are protective materials used to completely embed electronic circuitry. Typically, they are used to protect circuits from harmful effects of moisture and other contaminants, provide electrical insulation for high voltages and also protect the circuit and interconnections from thermal and mechanical stress. Encapsulants are typically applied in thick layers – exceeding 125 mµ.

DOWSIL™ and SYLGARD™ encapsulants are supplied as solventless, two-component liquid component kits. Many are designed for a 1:1 mixing ratio (parts A and B). When the two liquid components are thoroughly mixed, the mixture cures to a flexible elastomer. Some products will cure at room temperature while others are designed to be cured by heat.

Product Viscosity [mPas] Mixing ratio Cure time (Pot Life)  
DOWSIL™ 3-6121 Low Temperature Elastomer 19,000 10:1  20 min @100 °C, 10 min @150 °C (2h)
DOWSIL™ 3-6512 Elastomer 900 1:1 2 h @70 °C (24 h)
DOWSIL™ 3-8264 Encapsulant 2,650 1:1 2.5 h @70 °C, 30 min @100 °C
DOWSIL™ 93-500 Space Grade 8100 10:1 10 min @100 °C, 4 min @150 °C (3h)
DOWSIL™ 93-500 Thixotropic Encapsulant Non-flow 10:1 15 min @100 °C, 10 min @125 °C, 5 min @150 °C (1h)
DOWSIL™ SE 1816 CV Encapsulant 2,600 1:1 1 h @100 °C (24 h)
DOWSIL™ EE-1010 Low Viscosity Encapsulant 850 1:1  24 h @RT, 3 min @100 °C, 2 min @150 °C, (50 min) 
DOWSIL™ EE-1840 Encapsulant 1,300 1:1 7 d @25 °C, Heat accelerable (12 min)
DOWSIL™ EE-3200 Low Stress Encapsulant 1,700 1:1 20 min @50 °C (30 min)
SYLGARD™ 160 Silicone Elastomer 4,500 1:1 24 h @25 °C, 4 min @100 °C, (20 min) 
SYLAGRD™ 164 Silicone Elastomer 9,100 1:1 35 min @25 °C (-)
SYLGARD™ 170 Silicone Elastomer 2,100 1:1 24 h @25 °C , 45 min @50 °C , 25 min @70 °C , 15 min @80 °C , 10 min @100 °C (15 min) 
SYLGARD™ 170 Fast Cure Silicone Elastomer 2,300 1:1 10 min @25 °C (<5 min) 
SYLGARD™ 182 Silicone Elastomer 5,700 10:1 14 days @25 °C, 75 min @100 °C, 30 min @125 °C, 20 min @150 °C (8 h) 
SYLGARD™ 184 Silicone Elastomer 3,500 10:1 48 h @25 °C, 35 min @100 °C, 20 min @125 °C, 10 min @150 °C (90 min) 
SYLGARD™ 186 Silicone Elastomer 65,000 10:1 48 h @25 °C, 25 min @100 °C, 15 min @150 °C (100 min) 
SYLGARD™ 567 Primerless Silicone Encapsulant <1,500 1:1 180 min @70 °C 120 min @100 °C  (3 days)

Supplier

DOW™

Tradename(s)

DOWSIL™ SYLGARD™

Country availability

Austria Bosnia and Herzegovina
Bulgaria Croatia
Czech Republic Estonia
Germany Hungary
Latvia Lithuania
Macedonia Montenegro
Norway Poland
Romania Serbia
Slovakia Slovenia
Switzerland Turkey
Ukraine  

Other products from DOW™

Marica Djonovic

Contact person

Marica Djonovic

Supply Chain Specialist


email   phone

Further information

download

Electronics Portfolio
pdf (3.2 MB)


download

Silicone Encapsulants and Gels
pdf (1.2 MB)