Silicone Hotmelt Adhesive & Sealant

DOWSIL™

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. DOWSIL™ silicone adhesives are used primarily to attach components, such as module lids and baseplates, within electronic modules or seal openings in the module to exclude dirt, water or other contaminants. A key benefit of silicone adhesives is their potential to significantly increase the reliability of an electronic module or component because of their stress-relieving properties. The adhesives in our portfolio have a “rubbery”, elastomeric nature and are not conventional, highly rigid adhesives. This low stress environment can reduce damage to module components and interconnections. They are also able to maintain their stress-relieving nature throughout exposure to extreme environmental conditions such as high temperature and humidity. DOWSIL™ silicone adhesives also offer versatile processing. Some are cured at room temperature, while others can be accelerated by heat. This can allow faster process times or the use of lower temperature capable materials, depending on the needs of your application and process. More recently developed products are resulting in even faster and lower temperature curing capability. The line of adhesives available is also offered in a range of flow properties to fill gaps and channels, or to remain in place as the application requires. Many of the flowable products will self-level to fill channels and cavities.

DOWSIL™ hot melts are neutral cure sealants. Products are one-component and can ideally be applied at temperatures of approx. 120 °C. This technology allows a rapid adhesion on different substrates and also a long open time for assembly.

Product Hardness [ShA] Viscosity [mPas] Tack Free Time (Pot Life) 
DOWSIL™ EA-4600 HM RTV UV Adhesive 55 60,000 @120 °C  (24 h) 
DOWSIL™ HM 2600 Silicone Assembly Sealant 60 70,000 @120 °C 15 min (24 h) 
DOWSIL™ EA-5151 QiC Assembly Adhesive 60 70,000 @120 °C 15 min (24h)

Supplier

DOW™

Tradename(s)

DOWSIL™

Country availability

Austria Bosnia and Herzegovina
Bulgaria Croatia
Czech Republic Estonia
Germany Hungary
Latvia Lithuania
Macedonia Montenegro
Norway Poland
Romania Serbia
Slovakia Slovenia
Switzerland Turkey
Ukraine  

Other products from DOW™

Eray Berberoğlu

Contact person

Eray Berberoğlu

Product Manager


email   phone

Further information

download

Electronics Portfolio
pdf (3.2 MB)


download

Silicone Sealants Foams Industrial Assembly
pdf (374.8 KB)