Silicone Thermally Conductive Compounds
Product description
DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.
We offer a wide variety of thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many devices configurations and perform well in accommodating high tolerances between surfaces.
As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.
DOWSIL™ thermally conductive compounds are used as filling between heat source and heat sink. A very thin bond line thickness is achievable, but materials nevertheless show common properties such as low thermal resistance and high thermal conductivity. These no-cure materials offer thermal conductivity of up to 4.3 W/mK.
| Product | Thermal Conductivity [W/mK] | Viscosity [mPas] |
|---|---|---|
| DOWSIL™ 340 Heat Sink Compound | 0.67 | 542,000 |
| DOWSIL™ SC 102 Compound | 0.9 | 29,000 |
| DOWSIL™ SC 4471 CV Thermally Conductive Compound | 2 | 116,000 |
| DOWSIL™ SC 4476 CV Thermally Conductive Compound | 3.1 | 310,000 |
| DOWSIL™ TC-5080 Thermal Grease | 1 | 836,000 |
| DOWSIL™ SE 4490 CV Thermally Conductive Compound | 1.9 | 520,000 |
| DOWSIL™ TC-5021 Thermally Conductive Compound | 3.3 | 83,000 |
| DOWSIL™ TC-5026 Thermally Conductive Compound | 2.9 | 102,000 |
| DOWSIL™ TC-5121 C Thermally Conductive Compound | 2.8 | 79,000 |
| DOWSIL™ TC-5351 Thermally Conductive Compound | 3.3 | 300,000 |
| DOWSIL™ TC-5622 Thermally Conductive Compound | 4.3 | 95,000 |
| DOWSIL™ TC-5625 Thermally Conductive Compound | 2.5 | 102,125 |
| DOWSIL™ TC-5888 Thermally Conductive Compound | 5.2 | 100,000 |
Tradename(s)
DOWSIL™
Country availability
| Austria | Bosnia and Herzegovina |
| Bulgaria | Croatia |
| Czech Republic | Estonia |
| Germany | Hungary |
| Latvia | Lithuania |
| Macedonia | Montenegro |
| Norway | Poland |
| Romania | Serbia |
| Slovakia | Slovenia |
| Switzerland | Turkey |
| Ukraine |
Contact person
Hans-Günter Kainz
General Manager
Further information
Electronics Portfolio
pdf (3.2 MB)
Thermally Conductive Materials Selection Guide
pdf (1.5 MB)