Silicone Thermally Conductive Compounds

DOWSIL™

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.

We offer a wide variety of thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many devices configurations and perform well in accommodating high tolerances between surfaces.

As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.

DOWSIL™ thermally conductive compounds are used as filling between heat source and heat sink. A very thin bond line thickness is achievable, but materials nevertheless show common properties such as low thermal resistance and high thermal conductivity. These no-cure materials offer thermal conductivity of up to 4.3 W/mK.

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Tradename(s)

DOWSIL™

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