Silicone Thermally Conductive Dispensable Thermal Pads / Gap Filler

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.

We offer a wide variety of thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.

As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.

DOWSIL™ thermally conductive dispensable pads are used as filling between heat source and heat sink. Materials are developed for precise printing of silicone pads, which are needed in complex shapes. DOWSIL™ dispensable pads are delivered as two-component materials with a mixing ratio of 1:1. Curing reaction allows to accelerate with moderate heat of between 75 °C and 120 °C. Thermal pads offer thermal conductivity of up to 2.5 W/mK

Product Thermal Conductivity [W/mK] Viscosity [mPas] Cure time 
DOWSIL™ TC-4015 Dispensable Thermal Pad 1.71 103,000 48 min@75 °C, 16 min @100 °, 10 min @120 °C 
DOWSIL™ TC-4016 Dispensable Thermal Pad 1.71 103,000 48 min@75 °C, 16 min @100 °C, 10 min @120 °C 
DOWSIL™ TC-4025 Dispensable Thermal Pad 2.5 70,000 40 min@75 °C, 15 min @100 °C, 10 min @120 °C 
DOWSIL™ TC-4026 Dispensable Thermal Pad 2.5 70,000 40 min@75 °C, 15 min @100 °C, 10 min @120 °C 
DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler 3.4 205,000 120 min @25 °C, 10 min @80 °C 
DOWSIL™ TC-4525 Thermally Conductive Gap Filler 2.6 217,000 120 min @25 °C, 10 min @80 °C 
DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler 2.6 217,000 120 min @25 °C, 10 min @80 °C 
DOWSIL™ SE 4448 CV Thermally Conductive Gap Filler 2.2 51,500 300 min@25 °C, 30 min @120 °C
DOWSIL™ TC-4515 Thermally Conductive Gap Filler 1.8 240,000 150 min@25 °C, 30 min @80 °C
DOWSIL™ TC-4515 CV Thermally Conductive Gap Filler 1.8 151,000 120 min@25 °C, 10 min @80 °C 
DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 2.0 140,000 360min@25 °C, 30 min @80 °C 

Tradename(s)

DOWSIL™

Country availability

Austria Bosnia and Herzegovina
Bulgaria Croatia
Czech Republic Estonia
Germany Hungary
Latvia Lithuania
Macedonia Montenegro
Norway Poland
Romania Serbia
Slovakia Slovenia
Switzerland Turkey
Ukraine  
Eray Berberoğlu

Contact person

Eray Berberoğlu

Product Manager


email   phone

Further information

download

Electronics Portfolio
pdf (3.2 MB)


download

Thermally Conductive Materials Selection Guide
pdf (1.5 MB)