Silicone Thermally Conductive Adhesives

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.

We offer a wide variety of DOWSIL™ thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.

As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.

DOWSIL™ thermally conductive adhesives are used for the bonding of heat sinks and PCBs as well as for power supply housings. This class of adhesives offers strong and stable bonds to common printed circuit boards and shows an excellent thermal conductivity as high as 6.8 W/mK. A low volatile content will show no negative impact on components such as LED chips in lamps and luminaires.