Silicone One-part Moisture Cure RTV Adhesive & Sealants

Description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. DOWSIL™ silicone adhesives are used primarily to attach components, such as module lids and baseplates, within electronic modules or seal openings in the module to exclude dirt, water or other contaminants. A key benefit of silicone adhesives is their potential to significantly increase the reliability of an electronic module or component because of their stress-relieving properties. The adhesives in our portfolio have a “rubbery”, elastomeric nature and are not conventional, highly rigid adhesives. This low-stress environment can reduce damage to module components and interconnections. They are also able to maintain their stress-relieving nature throughout exposure to extreme environmental conditions such as high temperature and humidity. DOWSIL™ silicone adhesives also offer versatile processing. Some are cured at room temperature, while others can be accelerated by heat. This can allow faster process times or the use of lower temperature capable materials, depending on the needs of your application and process. More recently developed products are resulting in even faster and lower temperature curing capability. The line of adhesives available is also offered in a range of flow properties to fill gaps and channels, or to remain in place as the application requires. Many of the flowable products will self-level to fill channels and cavities.

These one-part adhesives utilise moisture from the atmosphere for curing. They are supplied ready-to-use and require no mixing equipment or ovens. The assembled parts can simply be set aside at normal room environments. Parts can be handled in 10-120 minutes and achieve full properties in 24-72 hours, depending on the product utilised and its bond line thickness. Some of our newer products are formulated for faster room temperature cures. Because these products require moisture from the outside, they are not suitable for highly confined or deep-section curing. Some acceleration of curing can be accomplished with mild heating at temperatures not exceeding 60 °C.  

Product data

ProductHardness [ShA]Viscosity [mPas]Tensile Strength [MPa]Tack Free Time (Cure time) 
DOWSIL™ 3145 RTV Mil-A-46146 Adhesive50 Non-flowing770 min (3-7 days @25 °C) 
DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant35 Non-flowing15 min (3-7 days @25 °C) 
DOWSIL™ 6-1104 CV Sealant45 Non-flowing6.765 min (3-7 days @25 °C) 
DOWSIL™ 730 FS Solvent Resistant Sealant40 3.3Non-flowing10 min (3-7 days @25 °C) 
DOWSIL™ 732 Multi-Purpose Sealant30 Non-flowing2.015 min (3-7 days @25 °C) 
DOWSIL™ 738 Electrical Sealant35 Non-flowing2.790 min (3-7 days @25 °C) 
DOWSIL™ 739 Plastic Adhesive25 Non-flowing1.575 min (3-7 days @25 °C) 
DOWSIL™ 744 RTV Adhesive Sealant35 Non-flowing2.540 min (3-7 days @25 °C) 
DOWSIL™ 7091 Adhesive 30 Non-flowing2.528 min (3-7 days @25 °C) 
DOWSIL™ 7092 Adhesive 50 Non-flowing2.030 min (3-7 days @25 °C) 
DOWSIL™ 7093 Adhesive 30 Non-flowing2.030 min (3-7 days @25 °C) 
DOWSIL™ 7094 Flowable Sealant20 33,0001.240 min (3-7 days @25 °C) 
DOWSIL™ SE 9100 Adhesive25 45,0002.510 min 
DOWSIL™ SE 9120 Adhesive25 6,5001.510 min (3-7 days @25 °C) 
DOWSIL™ SE 9120 S Adhesive20 7,0001.510 min (3-7 days @25 °C) 
DOWSIL™ SE 9152 HT Adhesive25 10,0003.020 min (3-7 days @25 °C) 
DOWSIL™ SE 9160 Adhesive35 20,0003.030 min (3-7 days @25 °C) 
DOWSIL™ SE 9168 RTV Adhesive40 Non-flowing3.55 min (3-7 days @25 °C) 
DOWSIL™ SE 9185 Adhesive25 Non-flowing3.010 min (3-7 days @25 °C) 
DOWSIL™ SE 9186 Sealant Adhesive20 65,0002.510 min (3-7 days @25 °C) 
DOWSIL™ SE 9188 RTV Adhesive30 Non-flowing3.010 min (3-7 days @25 °C) 
DOWSIL™ Q3-1566 Heat Resistant Adhesive45 Non-flowing3.55 min (3-7 days @25 °C) 
DOWSIL™ EA-2900 Sealant50 Non-flowing2.030 min (3-7 days @25 °C) 

Tradename(s)

  • DOWSIL™

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