Silicone Two-part Heat Cure Adhesive & Sealant
DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. DOWSIL™ and SYLGARD™ silicone adhesives are used primarily to attach components, such as module lids and baseplates, within electronic modules or seal openings in the module to exclude dirt, water or other contaminants. A key benefit of silicone adhesives is their potential to significantly increase the reliability of an electronic module or component because of their stress-relieving properties. The adhesives in our portfolio have a “rubbery”, elastomeric nature and are not conventional, highly rigid adhesives. This low stress environment can reduce damage to module components and interconnections. They are also able to maintain their stress-relieving nature throughout exposure to extreme environmental conditions such as high temperature and humidity. DOWSIL™ and SYLGARD™ silicone adhesives also offer versatile processing. Some are cured at room temperature, while others can be accelerated by heat. This can allow faster process times or the use of lower temperature capable materials, depending on the needs of your application and process. More recently developed products are resulting in even faster and lower temperature curing capability. The line of adhesives available is also offered in a range of flow properties to fill gaps and channels, or to remain in place as the application requires. Many of the flowable products will self-level to fill channels and cavities.
DOWSIL™ and SYLGARD™ two-part heat cure adhesives deliver greater control and flexibility in processing. Curing in a few minutes at temperatures of 150 °C or more energy-efficiently at lower temperatures. Material will be delivered as two-component material in mixing ratios of 1:1 and 10:1. This class of products cure in an additional reaction without any by-products.
|Product||Hardness [ShA]||Viscosity [mPas]||Cure time (Pot Life)|
|DOWSIL™ EA-6052 Fast Low-Temp Cure Adhesive||50||11,000||60 min @60 °C, 30 min @125 °C, 10 min @150 °C (6 h)|
|DOWSIL™ EA-6060 Adhesive||40||115,000||30 min @80 °C, 15 min @90 °C, 10 min @100 °C (1 h)|
|DOWSIL™ SE 1700 Adhesive||45||650,000||30 min @150 °C (8 h)|
|DOWSIL™ SE 1720 CV Adhesive||30||100,000||50 min @70 °C, 30 min @80 °C, 10 min @100 °C (6 h)|
|DOWSIL™ Q5-8401 Adhesive||60||70,000||90 min @120 °C (24 h)|
|SYLGARD™ 577 Primerless Silicone Adhesive||60||110,000||60 min @125 °C (22 h)|
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