Silicone Thermally Conductive Adhesives

DOWSIL™

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.

We offer a wide variety of DOWSIL™ thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.

As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.

DOWSIL™ thermally conductive adhesives are used for the bonding of heat sinks and PCBs as well as for power supply housings. This class of adhesives offers strong and stable bonds to common printed circuit boards and shows an excellent thermal conductivity as high as 6.8 W/mK. A low volatile content will show no negative impact on components such as LED chips in lamps and luminaires.

Product Thermal Conductivity [W/mK] Viscosity [mPas] Tack-Free Time or Cure Time
DOWSIL™ SE 9184 White RTV 0.84 Non-flowing 3 min
DOWSIL™ SE 4420 RTV Sealant 0.92 108,000 8 min
DOWSIL™ SE 4422 Thermally Conductive Adhesive 0.9 Semi-flowable 11 min
DOWSIL™ SE 4485 Thermally Conductive Adhesive 2.8 230,000 12 min
DOWSIL™ SE 4485L Thermally Conductive Adhesive 2.2 150,000 5 min
DOWSIL™ SE 4486 Thermally Conductive Adhesive 1.59 20,000 4 min
DOWSIL™EA-9189 H White RTV Adhesive 0.88 Paste 3 min
DOWSIL™ 3-6752 Thermally Conductive Adhesive 1.7 83,300 40 min @100 °C, 10 min @125 °C, 3 min @150 °C
DOWSIL™ 3-1818 Thermally Conductive Adhesive 1.7 76,000 60 min @100 °C, 45 min @100 °C, 10 min @100 °C
DOWSIL™ 1-4173 Thermally Conductive Adhesive 1.8 61,000 90 min @100 °C, 30 min @125 °C, 20 min @150 °C
DOWSIL™ 1-4174 Thermally Conductive Adhesive 1.78 62,300 90 min @100 °C, 30 min @125 °C, 20 min @ 50 °C
DOWSIL™ DA 6523 1,.8 23,400 60 min @150 °C
DOWSIL™ DA 6534 Adhesive 6.8 103,000 120 min @ 150 °C
DOWSIL™ Q1-9226 Thermally Conductive Adhesive 0.8 59,000 60 min @100 °C
DOWSIL™ 3-6753 Thermally Conductive Adhesive 1.0 10,120 50 min @100 °C, 40 min @125 °C, 10 min @150 °C
DOWSIL™ 3-6751 Thermally Conductive Adhesive 1.0 9,300 50 min @100 °C, 40 min @125 °C, 10 min @150 °C
DOWSIL™ TC-2022 Thermally Conductive Adhesive 3.3 190,000 15 min @100 °C
DOWSIL™ TC-2030 Adhesive 2.7 220,000 60 min @130 °C
DOWSIL™ TC-2035 Adhesive 3.3 125,000 30 min @125 °C, 10 min @150 °C

Supplier

DOW™

Tradename(s)

DOWSIL™

Country availability

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Other products from DOW™

Marica Djonovic

Contact person

Marica Djonovic

Supply Chain Specialist


email   phone

Further information

download

Electronics Portfolio
pdf (3.2 MB)


download

Silicone Sealants Foams Industrial Assembly
pdf (374.8 KB)


download

Thermally Conductive Materials Selection Guide
pdf (1.5 MB)