Silicone Thermally Conductive Encapsulants

DOWSIL™, SYLGARD™

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems. 

We are offering a wide variety of DOWSIL™  and SYLGARD™  thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.  

As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes. 

DOWSIL™ and SYLGARD™ thermally conductive encapsulants are used as potting materials for high voltage transformers and sensors, assembly of heat sinks and fillers between heat sources. 

Product Thermal Conductivity [W/mK] Hardness [ShA] Cure time (Pot Life) 
SYLGARD™ 160 Silicone Elastomer 0.62 56  24 h @RT, 4 min @100 °C (20 min) 
SYLGARD™ 164 Silicone Elastomer 0.64 61  36 min @RT (< 5 min) 
SYLGARD™ 170 Silicone Elastomer 0.48 50  24 h @RT, 45 min @50 °C, 10 min @100 °C (15 min) 
SYLGARD™ 170 Fast Cure Silicone Elastomer 0.4 45  10 min @ RT (< 5 min) 
SYLGARD™ Q3-3600 Thermally Conductive Encapsulant 0.8 89  60 min@150 °C 
SYLGARD™ 3-6605 Thermally Conductive Elastomer 0.85 79  90 min @100 °C,45 min @125 °C, 15 min @150 °C (>24 h) 
DOWSIL™ CN-8760 0.65 49 45 min @50 °C (100 min) 
DOWSIL™ CN-8760G  0.67 45 24 h @RT, 30 min @60 °C (100 min) 
DOWSIL™ TC-6020 Thermally Conductive Encapsulant 2.7 63  23 min @60 °C,13 min @80 °C, 5 min @100 °C 
DOWSIL™ 3-6651 Thermally Conductive Elastomer 1.1 55 Sh00 60 min @120 °C 
DOWSIL™ TC-4025 1.0 60 60 min @120 °C 
DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant 1.0 60 60 min @120 °C 
DOWSIL™ TC-6011 Thermally Conductive Encapsulant 1.0 28 60 min @120 °C 

Supplier

DOW™

Tradename(s)

DOWSIL™, SYLGARD™

Country availability

Austria Bosnia and Herzegovina
Bulgaria Croatia
Czech Republic Estonia
Germany Hungary
Latvia Lithuania
Macedonia Montenegro
Norway Poland
Romania Serbia
Slovakia Slovenia
Switzerland Turkey
Ukraine  

Other products from DOW™

Eray Berberoğlu

Contact person

Eray Berberoğlu

Product Manager


email   phone

Further information

download

Electronics Portfolio
pdf (3.2 MB)


download

Silicone Encapsulants and Gels
pdf (1.2 MB)


download

Thermally Conductive Materials Selection Guide
pdf (1.5 MB)