Silicone Thermally Conductive Encapsulants
Product description
DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.
We are offering a wide variety of DOWSIL™ and SYLGARD™ thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.
As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.
DOWSIL™ and SYLGARD™ thermally conductive encapsulants are used as potting materials for high voltage transformers and sensors, assembly of heat sinks and fillers between heat sources.
| Product | Thermal Conductivity [W/mK] | Hardness [ShA] | Cure time (Pot Life) |
|---|---|---|---|
| SYLGARD™ 160 Silicone Elastomer | 0.62 | 56 | 24 h @RT, 4 min @100 °C (20 min) |
| SYLGARD™ 164 Silicone Elastomer | 0.64 | 61 | 36 min @RT (< 5 min) |
| SYLGARD™ 170 Silicone Elastomer | 0.48 | 50 | 24 h @RT, 45 min @50 °C, 10 min @100 °C (15 min) |
| SYLGARD™ 170 Fast Cure Silicone Elastomer | 0.4 | 45 | 10 min @ RT (< 5 min) |
| SYLGARD™ Q3-3600 Thermally Conductive Encapsulant | 0.8 | 89 | 60 min@150 °C |
| SYLGARD™ 3-6605 Thermally Conductive Elastomer | 0.85 | 79 | 90 min @100 °C,45 min @125 °C, 15 min @150 °C (>24 h) |
| DOWSIL™ CN-8760 | 0.65 | 49 | 45 min @50 °C (100 min) |
| DOWSIL™ CN-8760G | 0.67 | 45 | 24 h @RT, 30 min @60 °C (100 min) |
| DOWSIL™ TC-6020 Thermally Conductive Encapsulant | 2.7 | 63 | 23 min @60 °C,13 min @80 °C, 5 min @100 °C |
| DOWSIL™ 3-6651 Thermally Conductive Elastomer | 1.1 | 55 Sh00 | 60 min @120 °C |
| DOWSIL™ TC-4025 | 1.0 | 60 | 60 min @120 °C |
| DOWSIL™ TC-4605 HLV Thermally Conductive Encapsulant | 1.0 | 60 | 60 min @120 °C |
| DOWSIL™ TC-6011 Thermally Conductive Encapsulant | 1.0 | 28 | 60 min @120 °C |
Tradename(s)
DOWSIL™, SYLGARD™
Country availability
| Austria | Bosnia and Herzegovina |
| Bulgaria | Croatia |
| Czech Republic | Estonia |
| Germany | Hungary |
| Latvia | Lithuania |
| Macedonia | Montenegro |
| Norway | Poland |
| Romania | Serbia |
| Slovakia | Slovenia |
| Switzerland | Turkey |
| Ukraine |
Contact person
Eray Berberoğlu
Product Manager
Further information
Electronics Portfolio
pdf (3.2 MB)
Silicone Encapsulants and Gels
pdf (1.2 MB)
Thermally Conductive Materials Selection Guide
pdf (1.5 MB)