Silicone Thermally Conductive Dispensable Thermal Pads / Gap Filler
Product description
DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.
We offer a wide variety of thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.
As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.
DOWSIL™ thermally conductive dispensable pads are used as filling between heat source and heat sink. Materials are developed for precise printing of silicone pads, which are needed in complex shapes. DOWSIL™ dispensable pads are delivered as two-component materials with a mixing ratio of 1:1. Curing reaction allows to accelerate with moderate heat of between 75 °C and 120 °C. Thermal pads offer thermal conductivity of up to 2.5 W/mK
| Product | Thermal Conductivity [W/mK] | Viscosity [mPas] | Cure time |
|---|---|---|---|
| DOWSIL™ TC-4015 Dispensable Thermal Pad | 1.71 | 103,000 | 48 min@75 °C, 16 min @100 °, 10 min @120 °C |
| DOWSIL™ TC-4016 Dispensable Thermal Pad | 1.71 | 103,000 | 48 min@75 °C, 16 min @100 °C, 10 min @120 °C |
| DOWSIL™ TC-4025 Dispensable Thermal Pad | 2.5 | 70,000 | 40 min@75 °C, 15 min @100 °C, 10 min @120 °C |
| DOWSIL™ TC-4026 Dispensable Thermal Pad | 2.5 | 70,000 | 40 min@75 °C, 15 min @100 °C, 10 min @120 °C |
| DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler | 3.4 | 205,000 | 120 min @25 °C, 10 min @80 °C |
| DOWSIL™ TC-4525 Thermally Conductive Gap Filler | 2.6 | 217,000 | 120 min @25 °C, 10 min @80 °C |
| DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler | 2.6 | 217,000 | 120 min @25 °C, 10 min @80 °C |
| DOWSIL™ SE 4448 CV Thermally Conductive Gap Filler | 2.2 | 51,500 | 300 min@25 °C, 30 min @120 °C |
| DOWSIL™ TC-4515 Thermally Conductive Gap Filler | 1.8 | 240,000 | 150 min@25 °C, 30 min @80 °C |
| DOWSIL™ TC-4515 CV Thermally Conductive Gap Filler | 1.8 | 151,000 | 120 min@25 °C, 10 min @80 °C |
| DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler | 2.0 | 140,000 | 360min@25 °C, 30 min @80 °C |
Tradename(s)
DOWSIL™
Country availability
| Austria | Bosnia and Herzegovina |
| Bulgaria | Croatia |
| Czech Republic | Estonia |
| Germany | Hungary |
| Latvia | Lithuania |
| Macedonia | Montenegro |
| Norway | Poland |
| Romania | Serbia |
| Slovakia | Slovenia |
| Switzerland | Turkey |
| Ukraine |
Contact person
Eray Berberoğlu
Product Manager
Further information
Electronics Portfolio
pdf (3.2 MB)
Thermally Conductive Materials Selection Guide
pdf (1.5 MB)