Silicone Thermally Conductive Dispensable Thermal Pads / Gap Filler

DOWSIL™

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.

We offer a wide variety of thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many device configurations and perform well in accommodating high tolerances between surfaces.

As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.

DOWSIL™ thermally conductive dispensable pads are used as filling between heat source and heat sink. Materials are developed for precise printing of silicone pads, which are needed in complex shapes. DOWSIL™ dispensable pads are delivered as two-component materials with a mixing ratio of 1:1. Curing reaction allows to accelerate with moderate heat of between 75 °C and 120 °C. Thermal pads offer thermal conductivity of up to 2.5 W/mK

Product Thermal Conductivity [W/mK] Viscosity [mPas] Cure time 
DOWSIL™ TC-4015 Dispensable Thermal Pad 1.71 103,000 48 min@75 °C, 16 min @100 °, 10 min @120 °C 
DOWSIL™ TC-4016 Dispensable Thermal Pad 1.71 103,000 48 min@75 °C, 16 min @100 °C, 10 min @120 °C 
DOWSIL™ TC-4025 Dispensable Thermal Pad 2.5 70,000 40 min@75 °C, 15 min @100 °C, 10 min @120 °C 
DOWSIL™ TC-4026 Dispensable Thermal Pad 2.5 70,000 40 min@75 °C, 15 min @100 °C, 10 min @120 °C 
DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler 3.4 205,000 120 min @25 °C, 10 min @80 °C 
DOWSIL™ TC-4525 Thermally Conductive Gap Filler 2.6 217,000 120 min @25 °C, 10 min @80 °C 
DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler 2.6 217,000 120 min @25 °C, 10 min @80 °C 
DOWSIL™ SE 4448 CV Thermally Conductive Gap Filler 2.2 51,500 300 min@25 °C, 30 min @120 °C
DOWSIL™ TC-4515 Thermally Conductive Gap Filler 1.8 240,000 150 min@25 °C, 30 min @80 °C
DOWSIL™ TC-4515 CV Thermally Conductive Gap Filler 1.8 151,000 120 min@25 °C, 10 min @80 °C 
DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler 2.0 140,000 360min@25 °C, 30 min @80 °C 

Supplier

DOW™

Tradename(s)

DOWSIL™

Country availability

Austria Bosnia and Herzegovina
Bulgaria Croatia
Czech Republic Estonia
Germany Hungary
Latvia Lithuania
Macedonia Montenegro
Norway Poland
Romania Serbia
Slovakia Slovenia
Switzerland Turkey
Ukraine  

Other products from DOW™

Eray Berberoğlu

Contact person

Eray Berberoğlu

Product Manager


email   phone

Further information

download

Electronics Portfolio
pdf (3.2 MB)


download

Thermally Conductive Materials Selection Guide
pdf (1.5 MB)