Silicone Thermally Conductive Compounds

DOWSIL™

Product description

DOW Silicones (formerly Dow Corning) delivers a wide variety of silicone-based polymers for diverse solutions in electric, electronic and energy applications. With increased miniaturisation of systems and increased circuit density, today’s electronics generate a large amount of heat. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems.

We offer a wide variety of thermally conductive materials to meet the needs of different applications. These materials include curing adhesives, encapsulants and gels, non-curing compounds, and dispensable thermal pads. They can be used in many devices configurations and perform well in accommodating high tolerances between surfaces.

As a class of materials, silicones maintain consistently high physical, electrical and optical performance at high temperatures. Available in a broad range of viscosities, cure chemistries and delivery formats, our products can help expand design and manufacturing latitudes.

DOWSIL™ thermally conductive compounds are used as filling between heat source and heat sink. A very thin bond line thickness is achievable, but materials nevertheless show common properties such as low thermal resistance and high thermal conductivity. These no-cure materials offer thermal conductivity of up to 4.3 W/mK.

Product Thermal Conductivity [W/mK] Viscosity [mPas]
DOWSIL™ 340 Heat Sink Compound 0.67 542,000
DOWSIL™ SC 102 Compound 0.9 29,000
DOWSIL™ SC 4471 CV Thermally Conductive Compound 2 116,000
DOWSIL™ SC 4476 CV Thermally Conductive Compound 3.1 310,000
DOWSIL™ TC-5080 Thermal Grease 1 836,000
DOWSIL™ SE 4490 CV Thermally Conductive Compound 1.9 520,000
DOWSIL™ TC-5021 Thermally Conductive Compound 3.3 83,000
DOWSIL™ TC-5026 Thermally Conductive Compound 2.9 102,000
DOWSIL™ TC-5121 C Thermally Conductive Compound 2.8 79,000
DOWSIL™ TC-5351 Thermally Conductive Compound 3.3 300,000
DOWSIL™ TC-5622 Thermally Conductive Compound 4.3 95,000
DOWSIL™ TC-5625 Thermally Conductive Compound 2.5 102,125
DOWSIL™ TC-5888 Thermally Conductive Compound 5.2 100,000

Supplier

DOW™

Tradename(s)

DOWSIL™

Country availability

Austria Bosnia and Herzegovina
Bulgaria Croatia
Czech Republic Estonia
Germany Hungary
Latvia Lithuania
Macedonia Montenegro
Norway Poland
Romania Serbia
Slovakia Slovenia
Switzerland Turkey
Ukraine  

Other products from DOW™

Eray Berberoğlu

Contact person

Eray Berberoğlu

Product Manager


email   phone

Further information

download

Electronics Portfolio
pdf (3.2 MB)


download

Thermally Conductive Materials Selection Guide
pdf (1.5 MB)