Epoxy adhesives can be divided into two groups: two-component (2C) and one-component (1C). They consist of an epoxy resin and various hardeners, which usually react with one another in a polyaddition.
In the case of 1C adhesives, epoxy resin and hardener are already mixed. The curing reaction is initiated by external energy input (heat, UV light, moisture). In the case of 2C adhesives, the epoxy resin and hardener are separated and mixed in a defined ratio immediately before the bonding process.
Epoxy adhesives are suitable for use in the bonding of metals and ceramics requiring high chemical resistance and strength. They are usually designed for gaps between 0.3 mm and 0.5 mm. Special, tough elastic epoxy adhesives can also be used for joint filling. The right choice of adhesive in combination with an optimal surface preparation is crucial for the perfect gluing.
|Liquid slow-setting||Fills a small gap, low consumption, robust joint||Metal, stone, glass and ceramic bonding|
|Fast-setting||Quick but high exothermal reaction in thick layer. Improved thermal resistance||Fast production, bonding of electric/electronic elements|
|Paste-toughened||High impact resistance, low tendency to crack propagation. Gap filling possible||Bonding of dissimilar materials e.g. metal to composite. Large parts bonding. Vertical joints.|
|Highly temperature-resistant||Improved stability, high shear strength at elevated temperatures. Resistant to water and many chemicals. Gap filling possible||Harsh environment bond. Bonding of chemical equipment and engine/motor parts. High voltage applications|
|1C thermal cure||No mixing required. High mechanical properties at extreme temperatures. Highest chemical resistance||Most demanding applications. Metal and ceramic bonding. ”Under the hood” elements|
|Transparent||Invisible joint, but be careful: epoxies yellow when exposed to UV||Arts, renovation, decoration, research & study, showroom models, advertising|
|Black||Thixotropic paste, possible gap filling||Bonding of carbon laminates and black design articles|
|Elastic||Highly flexibilised, no stress to bonded structure, good thermal shock resistance||Bonding of fragile/delicate elements and those exposed to extreme temperature shocks|
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