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Dow Corning to Highlight Advanced Materials Solutions for Demanding Power Electronics Applications at PCIM Europe 2016

Seneffe, Belgium – Dow Corning Corporation, a global leader in silicones, silicon-based technology and innovation, announced today that two of its electronics technical experts will speak at PCIM Europe 2016, scheduled to run in Nuremburg, Germany from May 10 to 12. The company, co-exhibiting with its German distributor Biesterfeld Spezialchemie, will also spotlight at Booth #519 in Hall 7 its broad and growing portfolio of advanced silicones for thermal management, protection and assembly of electronic modules, as well as its silicon carbide (SiC) wafer products for power device fabrication.

“As a leading global supplier of both silicone and silicon carbide technology, Dow Corning is uniquely positioned to help module makers create more efficient, reliable and cost-effective power electronic devices,” said Craig Bromley, European marketing manager, Electronics at Dow Corning. “Combined with our 70-year history of collaborative innovation with industry leaders, we are committed to helping customers along the entire electronics value chain to enhance the productivity, performance and reliability of power electronic products targeting advanced applications in transportation, industry and energy.”


Eric Vanlathem and Thomas Seldrum – Dow Corning application engineers – will present Posters* highlighting high-performance silicone solutions aimed at driving advances in power electronics. Titles and details of each poster include:

  • New Silicone Gel Enabling High Temperature Stability for Next Generation Power Modules, will detail and validate the performance of a silicone gel encapsulant that retains its flexibility, dielectric strength and adhesion to substrates after several thousands of hours of aging at 225° C.
  • Low Stress Silicone Encapsulant Enables Distributed Power Generation,” describes how Dow Corning® EE-3200 Low-Stress Silicone Encapsulant helps to minimize stress on power electronic components during thermal cycling, thereby helping to enhance the reliability, durability and lifetime of advanced conversion devices for distributed power generation.

The Dow Corning/Biesterfeld booth will showcase a very broad portfolio of silicone and SiC solutions for optimizing the performance, efficiency and reliability of power electronic modules. In addition to the low-stress EE-3200 gel featured during the poster session, Dow Corning will highlight other ground-breaking product technologies, including:

  • The new and recently launched Thermal Radical Cure™ technology, Dow Corning® EA-7100  Adhesive, which cures rapidly and at lower temperatures from the “inside out” to greatly accelerate processing, lower energy use and reduce material costs. This advanced adhesive can form strong bonds to a broad range of materials including traditionally challenging substrates such as polyethylene, polycarbonate and acetal without requiring pre-treatment or extensive cleaning.
  • High-heat resistant solutions, such as Dow Corning® EG-3896 and Dow Corning® EG-3810 Dielectric Gels target power modules rated at 175° C. These advanced encapsulant materials withstand higher junction temperatures, allowing for higher power densities that, in turn, enable development of smaller modules.
  • Thermal management solutions, such as Dow Corning® TC-4525 Thermally Conductive Gap Filler delivers thermal conductivity of 2.5 W/mK, greatly improved dispensability, significantly reduced abrasiveness and stable performance for more reliable electronics in harsh automotive underhood environments.

A further highlight at the booth will be Dow Corning’s portfolio of high-quality 4H n+ SiC solutions for power electronics applications. The company offers three tiers of manufacturing quality SiC substrates available as 100- or 150-mm-diameter wafers (bare) and with SiC epitaxial layers (n- or p-type). Labeled Prime Standard, Prime Select and Prime Ultra, each wafer tier offers progressively more stringent tolerances on critical defect types that adversely impact device performance.

A trusted innovation leader, Dow Corning materials and collaborative expertise span the entire power electronics value chain, from wafer fabrication to device packaging solutions to complete module and system assembly. For decades, leading power electronics companies around the world have turned to Dow Corning for high performance materials and technologies, advanced application expertise, reliable supply and customer service around the globe. To learn more about Dow Corning’s advanced materials, please visit www.dowcorning.com.

Biesterfeld’s electronic team supports with product selection tailored to the individual needs of each customer. This includes technological expertise and customized solutions as well as comprehensive market knowledge. For more information about Biesterfeld Spezialchemie, please visit www.biesterfeld-spezialchemie.com.

Contact Biesterfeld: electronics.solutions[at]biesterfeld.com.

* Poster-Presentations: Conference Programme, Packaging Technologies and Materials, Thursday May 10, 2016, 15.30-17:30Uhr

About Dow Corning

Dow Corning (dowcorning.com) provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning® and XIAMETER® brands. Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States. Dow Corning’s global operations adhere to the American Chemistry Council’s Responsible Care® initiative, a stringent set of standards designed to advance the safe and secure management of chemical products and processes.

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Biesterfeld AG, Henrike Riemann

Henrike Riemann

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